A large volume metrology process model for integrating design and manufacturing

Yanwu Guo, Bin Cai, Jafar Jamshidi, Paul G. Maropoulos

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    To deal with the increasing challenges faced in large volume manufacturing and assembly industries, a generic methodology is developed which integrates metrology process models, design evaluation and assembly planning. This paper describes the specification of a novel, theoretical framework for the metrology process models, especially focusing on large volume, frameless metrology that is suitable for the verification of large and complex products. The process modelling framework has four generic sections that support early design evaluation, assembly process interface, setup and deployment, and verification data management. A system is proposed to realize the metrology process model in digital manufacturing environment by four stages. Initial testing results of first stage, using aerospace products, demonstrated the effectiveness of the process modelling methods.

    Original languageEnglish
    Title of host publication5th International Conference on Digital Enterprise Technology, DET 2008
    Pages793-805
    Number of pages13
    ISBN (Electronic)9782748345988
    Publication statusPublished - 2008
    Event5th International Conference on Digital Enterprise Technology, DET 2008 - Nantes, France
    Duration: 22 Oct 200824 Oct 2008

    Conference

    Conference5th International Conference on Digital Enterprise Technology, DET 2008
    CountryFrance
    CityNantes
    Period22/10/0824/10/08

    Keywords

    • Assembly planning
    • Digital manufacturing
    • Measurement planning
    • Metrology process model
    • Process planning

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  • Cite this

    Guo, Y., Cai, B., Jamshidi, J., & Maropoulos, P. G. (2008). A large volume metrology process model for integrating design and manufacturing. In 5th International Conference on Digital Enterprise Technology, DET 2008 (pp. 793-805)