Enhancing information technology requires sufficient heat removal from electronic devices. This article attempts to investigate experimentally and numerically new procedures to avoid hot spots as well as to manage the thermal load. To maintain these critical requirements, it is necessary to minimize the size of the electronic components and utilize specified working fluids rather than traditional ones. Utilizing nanofluid that is an innovative heat-transfer fluid is a promising solution for cooling electronic components. The enhancement of thermal performance in electronic components using different nanofluids is studied. The nanofluids characteristics and their thermophysical properties; heat transfer augmentation system using nanofluids; various limitations, challenges in applying the nanofluids for electronic components and conclusions and recommendations are presented.
|Title of host publication||Encyclopedia of Smart Materials|
|Subtitle of host publication||Thermal, Electrochemical and Electronic Materials|
|Number of pages||9|
|Publication status||Published - 2022|
- Electronic components
- Thermal Performance