Abstract
Effective air cooling remained critical for high-power electronics as heat fluxes increased. This study integrated experimental measurements, three-dimensional Computational Fluid Dynamics simulations (CFD), and an Artificial Neural Network (ANN) surrogate model to assess air-cooled plate-fin heat sinks under forced convection. Five different modified designs with segmented and staggered fins achieved up to 46.8% reduction in junction-to-ambient thermal resistance relative to the baseline, but the most aggressive layout (HS6) raised the pressure drop to approximately 1000 Pa, about 20x higher. The trained neural network model reproduced CFD temperatures and pressure drops with R2 > 0.99, enabling rapid exploration of the design space. From these data, two closed-form correlations for maximum junction temperature and pressure drop were derived, offering instant estimates during preliminary design without further CFD runs. Overall, staggered-segmented fins delivered substantial thermal gains, yet the associated rise in pumping power must be weighed during early design.
| Original language | English |
|---|---|
| Article number | 110109 |
| Number of pages | 20 |
| Journal | International Journal of Thermal Sciences |
| Volume | 218 |
| Early online date | 8 Jul 2025 |
| DOIs | |
| Publication status | E-pub ahead of print - 8 Jul 2025 |
Bibliographical note
Copyright © 2025 Elsevier Masson SAS. All rights are reserved, including those for text and data mining, AI training, and similar technologies. This accepted manuscript version is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License [https://creativecommons.org/licenses/by-nc-nd/4.0/].Keywords
- Air cooling
- ANN
- CFD
- Forced convection
- Power electronics
- Thermal resistance