Electronic devices are being used extensively for different applications, where the thermal management of these devices is still a critical challenge due to rapid miniaturization, high heat flux and constantly rising temperature. Phase change materials (PCMs) based thermal management is adopted, but the low thermal conductivity limits their use in temperature-controlled electronic devices. Nano-enhanced phase change materials (NePCMs) can advance the heat transfer rate (HTr), decrease the temperature, and increase the operating time of the electronic device. The present study compares the thermal performances (TP) of three different heat sinks (simple, circular pin finned and copper foam) with NePCM (RT54HC/Al2O3) and varying Al2O3 nanoparticles concentrations (0.15–0.25 wt%) and heat fluxes (0.98–2.94 kW/m2) to optimize the overall device performance. The results show that at a heat flux (HF) of 0.98 kW/m2 and 0.25 wt% of Al2O3 nanoparticles (NPs), the base temperature of simple, circular pin finned and Cu foam heat sink was reduced by 21.3%, 25.03%, and 36.2%, respectively. The Cu foam heat sink (HS) has exceptional TP than the HSs without Cu foam. Accordingly, NePCMs are highly recommended in electronic devices for an optimized thermal management system.
|Number of pages||13|
|Journal||Case Studies in Thermal Engineering|
|Early online date||22 Nov 2022|
|Publication status||Published - Jan 2023|
Bibliographical noteCopyright © 2022, The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license
(https://creativecommons.org/licenses/by-nc-nd/4.0/). Funding & Acknowledgement: The authors are thankful to the University of Engineering and Technology Lahore for funding through grant No: ORIC/110-ASRB/1641 to execute the current research work.