Experimental investigation for thermal performance enhancement of various heat sinks using Al₂O₃ NePCM for cooling of electronic devices

Keyphrases

• Electronic Devices 100%
• Aluminum Oxide 100%
• Heat Sink 100%
• Electronics Cooling 100%
• Nano-encapsulated Phase Change Material (NEPCM) 100%
• Thermal Performance Enhancement 100%
• Cu Foam 75%
• Heat Flux 50%
• Thermal Performance 50%
• Thermal Management 50%
• Al2O3 Nanoparticles 50%
• Finning 50%
• Heat Transfer Rate 25%
• Device Performance 25%
• Material-based 25%
• Operating Time 25%
• Miniaturization 25%
• Temperature Control 25%
• Low Thermal Conductivity 25%
• Phase Change Material 25%
• Nanoparticle Concentration 25%
• High Heat Flux 25%
• Rising Temperature 25%
• Copper Foam 25%
• Base Temperature 25%
• Thermal Management System 25%

Material Science

• Aluminum Oxide 100%
• Phase Change Material 100%
• Aluminium Oxide Nanoparticle 40%
• Thermal Conductivity 20%

Chemical Engineering

• Heat Flux 100%
• Nanoparticle 66%
• Thermal Conductivity 33%