Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC

H. Chen, W. Cao, Z. Tan, P. Bordignon, R. Yi, H. Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

For the Modular Multilevel Converter (MMC) based VSC HVDC, typical topology of its submodules is a half bridge circuit and plastic module IGBTs (PMIs) are common power devices for a submodule. However, PMIs have a relatively short lifetime and open-circuit failure mode, which make them less suitable for power systems. On the other hand, press-pack IGBT/IEGT (PPIs) can offer a much longer lifetime, the unique short-circuit failure mode (SCFM), and higher current carrying capabilities. Hence, PPIs are perfect device for MMC HVDC, especially for future higher rating systems. The ±160kV/200MW MMC converter is the largest one in the Nan'ao multi-terminal VSC HVDC system, and it is also the world's first MMC that is based on single-level PPI devices. This paper will look into detailed hardware design of this MMC converter from device to valve, it will also provide key testing results of submodules.

Original languageEnglish
Title of host publication8th IET International Conference on Power Electronics, Machines and Drives (PEMD 2016), 2016
PublisherIET
Number of pages6
ISBN (Print)978-1-78561-188-9
DOIs
Publication statusPublished - 10 Nov 2016
Event8th IET International Conference on Power Electronics, Machines and Drives - Glasgow, United Kingdom
Duration: 19 Apr 201621 Apr 2016

Conference

Conference8th IET International Conference on Power Electronics, Machines and Drives
Abbreviated titlePEMD 2016
CountryUnited Kingdom
CityGlasgow
Period19/04/1621/04/16

Bibliographical note

-

Keywords

  • modular multilevel converter
  • offshore renewable energy
  • press-pack IGBT/IEGT
  • VSC-HVDC

Fingerprint Dive into the research topics of 'Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC'. Together they form a unique fingerprint.

  • Research Output

    • 6 Conference contribution

    Asymmetrical rotor design for a synchronous machine based on surrogate optimisation algorithm

    Yang, N., Cao, W., Tan, Z., Song, X., Littler, T. & Morrow, J., 10 Nov 2016, 8th IET International Conference on Power Electronics, Machines and Drives (PEMD 2016), 2016. IET, 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Battery energy storage systems for the electricity grid: UK research facilities

    Feehally, T., Forsyth, A. J., Todd, R., Foster, M. P., Gladwin, D., Stone, D. A. & Strickland, D., 10 Nov 2016, 8th IET International Conference on Power Electronics, Machines and Drives (PEMD 2016), 2016. IET, 6

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Open Access
  • Design considerations of a shunt calorimeter for high-efficiency electrical machines and drives

    Cao, W., Chen, H., Aarniovuori, L., Yang, N. & Pickert, V., 10 Nov 2016, 8th IET International Conference on Power Electronics, Machines and Drives (PEMD 2016), 2016. IET, 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Cite this

    Chen, H., Cao, W., Tan, Z., Bordignon, P., Yi, R., & Zhang, H. (2016). Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC. In 8th IET International Conference on Power Electronics, Machines and Drives (PEMD 2016), 2016 IET. https://doi.org/10.1049/cp.2016.0225