Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC

H. Chen, W. Cao, Z. Tan, P. Bordignon, R. Yi, H. Zhang

Research output: Chapter in Book/Published conference output › Conference publication

Fingerprint

Dive into the research topics of 'Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC'. Together they form a unique fingerprint.

Engineering & Materials Science