We have investigated the evolution of radiation damage and changes in hardness of sputter-deposited Cu/V nanolaminates upon room temperature helium ion irradiation. As the individual layer thickness decreases from 200 to 5 nm, helium bubble density and radiation hardening both decrease. The magnitude of radiation hardening becomes negligible for individual layer thickness of 2.5 nm or less. These observations indicate that nearly immiscible Cu/V interface can effectively absorb radiation-induced point defects and reduce their concentrations.
Fu, E. G., Zhang, X., Carter, J., Shao, L., Swadener, G., Misra, A., & Wang, H. (2009). Size dependent enhancement of helium ion irradiation tolerance in sputtered Cu/V nanolaminates. Journal of Nuclear Materials, 385(3), 629-632. https://doi.org/10.1016/j.jnucmat.2008.12.308