Thermal stability of sputter-deposited 330 austenitic stainless-steel thin films with nanoscale growth twins

X. Zhang, A. Misra, H. Wang, J.G. Swadener, A.L. Lima, M.F. Hundley, R.G. Hoagland

Research output: Contribution to journalArticle

Abstract

We have explored the thermal stability of nanoscale growth twins in sputter-deposited 330 stainless-steel (SS) films by vacuum annealing up to 500 °C. In spite of an average twin spacing of only 4 nm in the as-deposited films, no detectable variation in the twin spacing or orientation of twin interfaces was observed after annealing. An increase in the average columnar grain size was observed after annealing. The hardness of 330 SS films increases after annealing, from 7 GPa for as-deposited films to around 8 GPa for annealed films, while the electrical resistivity decreases slightly after annealing. The changes in mechanical and electrical properties after annealing are interpreted in terms of the corresponding changes in the residual stress and microstructure of the films.
Original languageEnglish
Article number233116
Number of pages3
JournalApplied Physics Letters
Volume87
Issue number23
DOIs
Publication statusPublished - 5 Dec 2005

Bibliographical note

© 2005 American Institute of Physics.Thermal stability of sputter-deposited 330 austenitic stainless-steel thin films with nanoscale growth twins
Appl. Phys. Lett. 87, 233116 (2005)

Keywords

  • nanoscale growth twins
  • orientations
  • twin interfaces
  • vacuum annealing
  • electric conductivity
  • residual stresses
  • sputter deposition
  • thermodynamic stability

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