We report a process for the lift-off of an ultrathin Si layer. By plasma hydrogenation of a molecular-beam-epitaxy-grown heterostructure of SiSb-doped-SiSi, ultrashallow cracking is controlled to occur at the depth of the Sb-doped layer. Prior to hydrogenation, an oxygen plasma treatment is used to induce the formation of a thin oxide layer on the surface of the heterostructure. Chemical etching of the surface oxide layer after hydrogenation further thins the thickness of the separated Si layer to be only 15 nm. Mechanisms of hydrogen trapping and strain-facilitated cracking are discussed.
Bibliographical note© 2005 American Institute of Physics. Strain-facilitated process for the lift-off of a Si layer of less than 20 nm thickness. Lin Shao et al. Applied Physics Letters 2005 87:25
- plasma hydrogenation
- strain-facilitated cracking
- ultrashallow cracking
Shao, L., Lin, Y., Swadener, J. G., Lee, J. K., Jia, Q. X., Wang, Y. Q., Nastasi, M., Thompson, P. E., Theodore, N. D., Alford, T. L., Mayer, J. W., Chen, P., & Lau, S. S. (2005). Strain-facilitated process for the lift-off of a Si layer of less than 20 nm thickness. Applied Physics Letters, 87(25), 1-3. . https://doi.org/10.1063/1.2146211